Wafer-Handling.Com offers vortex wafer wands that are pneuma-mechanical devices which handle either standard or fragile substrates without contact. (Similar pneuma-electrical devices already have found popularity in a variety of applications.)
A wide variety of vortex wand designs ease operations on the production floor for all kinds of applications including but not limited to:
* Use for 4”~12”, 50 µm thin to standard thickness; warped, bumped or perforated wafer, glass, or solar cell
* Compatibility with most standard cassettes, FOUP/FOSB & HWS (horizontal wafer shipping box)
* Side supporting rails maintain stability and permit safe wafer flipping
* Materials compatible for semiconductor wafer processing, ESD safe
Handles 6", 8", 12" in diameter; 50 micron to 800 micron in thickness included bonded wafers
For circular, square and rectangular shape substrates or with carriers
Bridge type for 4"-6", 6"-8" with no or minimal change-over, size conversion kits available
Top Approach
Bottom Approach
Side Approach
| Spec | 200mm | 300mm |
|---|---|---|
| Blade thickness | <3mm | <3mm |
| Wafer spacing to end effector | 100µ ~ 500 µ | 100µ ~ 500 µ |
| Wafer thickness | 50µ - 800µ | 50µ - 800µ |
| Compress air | 20 ~ 60 PSI | 20 ~ 60 PSI |
| Weight | ~200g | ~500g |