Our IEG Aligner-300xM is a powerful plug-and-play solution that completes high accuracy wafer alignment in under 3 seconds. The aligner incorporates the features from our innovative line of edge grippers, shortening the overall cycle time. The aligner's soft-touch mechanism with programmable gripping force enables the gripping tips to gently touch the wafer, preventing wafer stress and particle generation. Regardless of wafer size and thickness deviations, it maintains a secure hold with constant optimized gripping force, helping you achieve higher throughput.
The IEG Aligner-300xM comes with our edge grip self-centering feature that allows you to achieve significantly higher reliability and helps minimize particle creation associated with friction during wafer shifts and drops.
As with all of our wafer-handling products, the IEG Aligner-300xM has been proven to have absolutely no back side contamination.
The IEG Aligner-300xM is equipped with graphical user interface that provides simple and fast setup and modification. The aligner uses available system power and is compatible with most operating systems and hardware platforms. RS-232, RS-485, or Ethernet ports allow for standalone and networked operation.
Handles, 8", 12" in diameter; >200 micron in thickness
For circular wafers only
No bridge available
For standard, semi- and transparent wafers
Aligning with buffering
Aligning without buffering
|Orientation||Notch only||Notch only|
|Allowable wafer Misalignment||1mm for std nominal diameter||1mm for std nominal diameter|
|Power Consumption||24 V DC, 800 mA||24 V DC, 800 mA|
|Communication||RS232, RS422||RS 232, RS422|
|Weight||~13 lb (6 kg)||~20 lb (9 kg)|