Handles 2", 4", 5", 6", 8", 12" in diameter; 300 micron to 6mm in thickness included bonded wafers
For circular, square and rectangular shape substrates or substrate with carriers (carrier wafer, frame, tape)
Bridge type for 4"-6", 6"-8" with no or minimal change-over, size conversion kits available
Top-approach /Top-pick
Bottom-approach/Bottom-pick
Edge-grip proximal centering
Tip-fix positioning (one axis)
Self-centering (two axis)
FOUP/BOSB, cassette, magazine, boat
Ultra thin blade for small pitch or thick wafers in a standard carrier
Wet environment
High Temperature
Chemical fumed environment
Spec | 200mm | 300mm |
---|---|---|
Programmable Gripping Force | 1-8N | 2-12N |
Wafer Placing Accuracy | Angular<0.1 deg. |
Angular<0.1 deg. Linear<10 mircon |
Allowable Wafer Misalignment | +-5mm | +-5mm |
Grip/un-grip time | 0.25 sec | 0.25 sec |
Min. cassette Pitch | 6mm | 10mm |
Power Consumption | 0.35A/24V DC | 0.35A/24V DC |
Robot Intertace | RS232, RS485, RS422, CAN, I/O | RS232, RS485, RS422, CAN, I/O |