Wafer-Handling.com’s vortex end effector provides superior handling of all types of wafers, including thin wafers, with only edge contact between the wafer and the end effector. The gripper’s minimal airflow requirements and our edge grip Soft-Touch feature clearly distinguishes it from other wafer handling products. By integrating our Soft Touch mechanism, the end effector overcomes any potential problems associated with thin wafer handling such as side ward shifting or rotation, while sparing the wafer the harsh handling of a pneumatic edge grip.
An optical wafer presence sensor, integrated within the end effector, allows the robot to activate the Soft Touch mechanism at precisely the right time. The grip mechanism lets the robot know that the grip was successful, and can report the wafer’s actual diameter for improved placement precision.
Handles 4", 5", 6", 8", 12" in diameter; 50 micron to 800 micron in thickness
For circular, square and rectangular shape substrates or with carriers
Max 8mm warpage/bow, and potato-chip like thin wafer
Top Approach
Bottom Approach
Tip-fix positioning (one-axis)
Self-centering (two axis)
Self-centering (two axis)
FOUP, cassette, boat
Ultra thin blade for small pitch
High Temperature
Wet
Chemical fumed environ
| Spec | 200mm | 300mm |
|---|---|---|
| Wafer thickness | 50 µm -800 µm | 50 µm -800 µm |
| Wafer spacing to end effector | ~100 µm | ~100 µm |
| Power consumption | 12/24V, 350mV | 12/24V, 350mV |
| Compress air | 60 PSI | 60 PSI |
| Control Logic | ASCII command string or digital I/O | ASCII command string or digital I/O |
| Communication | I/O (6 wires), RS232, RS485 or CAN | I/O (6 wires), RS232, RS485 or CAN |