Wafer-Handling.com’s high intelligence aligner is a powerful wafer alignment solution that yields repeatability of ± 25 µm (radial) & ± 0.02° (angular). A safe aligner for fragile wafers with its SoftTouch programmable gripping force. Align thin, thick, warped, transparent, translucent, perforated, Taiko wafers. 6”/8” bridge edge grip aligner now available.
Applied the Soft Touch mechanism means that gripping tips do not shoot on the wafer, but gently touch (hug) the wafer edge. Its rotating distal gripping tips is a feature that allows for random access of 200mm wafers into small pitch cassette, boat or any narrow gates. Optional flipping feature, applied on any robot.
Market leading IOSS wafer ID reader, seamlessly integrated our aligner, offers intelligent optical ID captureing in Datamatrix, OCR and Barcode for all kinds of substrate size, material /coating, notched or flatted.
· Support FOUP/FOSB/cassette.
· For 8" and 12" wafers.
· Communication: RS458, Ethernet
· Detects presence of two wafers in single slot.
This 8” wafer tilt rotation station is designed for special wafers (thin and warped wafers or thick bonded wafers), it grabs only at the exclusion zone to free rotation and 245˚ tilt. It can be a stand-alone visual macro inspection and/or a sub-system to be integrated to your inspection system with simple TCP/IP communication.
· For 6" or 8" wafer
· Wafer front/back side and edge macro inspecting and algning
· Can be customized for most model of microscope
· Optional two side wafer ID reading
The reason for choosing wafer-handling.com is when you need a handling tool that keeps 100% of your wafers from breakage, chipping and contamination. From thin warped wafer to compound wafer such as SiC, GaN, GaAs, we offer contact or non contact type handling tool for your special needs...