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The Company

About

As the semiconductor world pursues new process technology for next generation product, it brings profound difficulty and complexity of wafer handling on the manufacturing floor. Wafer-handling.com is a company in Silicon Valley established to meet today and tomorrow's wafer handling needs. Wafer-handling.com is equipped with 20-year experience in developing intelligent wafer handlers for robotic automation to serve global automation companies and semiconductor OEM equipment makers and fabs.

Our expertise lies in handling fragile and specialized wafers; all components are manufactured in-house to easily adapt to clients' needs. We developed a comprehensive line of non-contact (exclusion zone contact only) thin wafer handling solutions suitable for 4"~12" notched or flatted, opaque/translucent/transparent, thin, warped, or Taiko wafers.

We offer standard plug-and-play and custom products that are compatible to most robots in the market. With the sophisticate sensors designed in each product, it prevents wafer breakage and edge-chipping. .

Event

EVENT BOOTH# CO-EXiHIBIT
Semicon Taiwan, 2024 R7522 Wonder Automation Inc.

Core Technology

Vortex Principle

This vortex type component is contactless: the compressed air arrives at the vortex cup tangent to the circumference and creates an area of very low pressure in the center of the cup. The low pressure creates lifting force similar to vacuum suction cup, but at the same time air needs a space to escape and creates gap between wafer and cup edge. The exiting laminar air flow prevents the wafer from contacting the blade while the low pressure at the center of the cups holding the wafer in place.

SoftTouch

The slightest contact between gripper tips and the wafer edge sends a signal to the device’s control mechanism, which in turn calculates and applies the applicable pre-programmed gripping force. Regardless of wafer diameter deviations, this feature prevents particle generation and enables secure hold with constant gripping force.