Our wafer mapping sensor offers a cost-effective and reliable detection of slotting errors in cassettes or FOUPs. This mapper can detect any double-, empty- and cross-slotted status and wafer-misplacement. It can map all sorts of wafers regardless of wafer coating, edge geometry and thickness. It outperforms most reflective type mappers in detecting low reflectivity wafers, transparent wafers and thin warped wafers. It works with compressed pitch and with minimal engagement (≥3mm) from wafer edge. They are immune to ambient light to keep highly stable detection performance. It's a plug-and-play module and compatible with most popular brands.
Most of the sensors can be stand-alone products or integrated with edge or vacuum grip end-effectors perfect for working in a limited space.
Handles 2", 4", 5", 6", 8", 12" in diameter; 50 micron to 6mm in thickness included bonded wafers
For circular, square and rectangular shape substrates or with carriers
Bridge type for 4"-6", 6"-8", 8"-12"
Chemical fumed environ
|NPN open collector||100mA||100mA|
|Laser class||Class 1||Class 1|
|Ambient light protection||Incorporated||Incorporated|
|Compressed cassette pitch||~5mm||~5mm|
|Wafer Placing Accuracy||24V/250mW||24V/250mW|
|Temperature||0~60 deg||0~60 deg|