SAN JOSE, Calif., Jul. 19, 2012 -- Wafer-handling.com, a supplier of intelligent wafer handling components used to improve handling performance for the semiconductor devices, photovoltaics and high-brightness LEDs (HB-LEDs), today announced that it has acquired the assets of the Wafer Handling Division of a leading robotic solution company in California, who designed and manufactured non-contact wafer gripping devices with hundreds of installation worldwide since 2000. With this acquisition, Wafer-handling.com has the intellectual property (IP) portfolio of advanced wafer handling solutions for new markets such as Micro-electro-mechanical systems (MEMS) and 3D-IC packaging.
The latest trend for wafer handling, such as non-contact top-pick wafers from a process chuck, or picking up fragile wafers with warpage or holes, generate challenges to the existing vacuum-grip technology. As a result of 12-year development, the acquired handling technology provides the time-to-market solution for robot supplier, system integrator and equipment manufacturers. With the market proven IP and a group of talented designers, Wafer-handling.com will continue to help the industry to prevent wafer breakage that caused by traditional handlers. ###