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2012- 07/19

SAN JOSE, Calif., Jul. 19, 2012 --, a supplier of intelligent wafer handling components used to improve handling performance for the semiconductor devices, photovoltaics and high-brightness LEDs (HB-LEDs), today announced that it has acquired the assets of the Wafer Handling Division of a leading robotic solution company in California, who designed and manufactured non-contact wafer gripping devices with hundreds of installation worldwide since 2000. With this acquisition, has the intellectual property (IP) portfolio of advanced wafer handling solutions for new markets such as Micro-electro-mechanical systems (MEMS) and 3D-IC packaging.

The latest trend for wafer handling, such as non-contact top-pick wafers from a process chuck, or picking up fragile wafers with warpage or holes, generate challenges to the existing vacuum-grip technology. As a result of 12-year development, the acquired handling technology provides the time-to-market solution for robot supplier, system integrator and equipment manufacturers. With the market proven IP and a group of talented designers, will continue to help the industry to prevent wafer breakage that caused by traditional handlers. ###