To replace/upgrade a Brooks/PRI PRE300 vacuum chuck aligner with a higher precision aligner in a wafer ID laser marking system
• Hard to acquire repair part
• Back side mark & particle generated during aligning
• Can't handle thin or glass wafers
• Higher accuracy required (± 25 µm/ radial & ± 0.02° )
• Most edge grip aligners on market can’t accommodate big wafer displacement handled by the vacuum end effector in the tool
We modified our current non-contact high-precision edge grip aligner, EGP 300, to be a hybrid of vortex, vacuum and edge grip with a 12mm tolerance of wafer displacement while targeting a high precision alignment.
It has identical form-factor as current Equip PRE-300, also its command emulator for drop-in replacement, all behind the scene , no tool host modification required. Other features including:
Illustration: Works with up to 12mm wafer displacement (good compensation for off-centered wafer sits in a cassette/FOUP and handled by vacuum or vortex type end effector)
· High repeatability: ± 25 µm/radial & ± 0.02° /angular
· SoftTouch stress-free grip alignment
· Contamination & mark free design
· Align thin, thick, warped, transparent, perforated, Taiko wafers